Description: Free Shipping "275" Lead Free No-Clean Solder is designed to reduce spattering common to most core flux solders. No-clean solder eliminates the need and additional expense of residue removal while providing excellent solderability and fast wetting to a variety of surface finishes. Applications • SMT and hand soldering assembly applications Product Performance • Colorless, translucent residue • Improves wetting performance • Excellent solderability and fast wetting to a variety of surface finishes • Eliminates the need and expense of cleaning • Low smoke and odor • Low spattering • Residues are non-conductive, non-corrosive• Concorde-Electronics is an Authorized Kester Solder distributor Specifications • Alloy: Sn96.5 / Ag3.0 / Cu0.5 (96.5 % tin 3% silver 0.5% copper)• Wire Diameter: .031" • Melting Range: approximately 423-428º F, 217-330º C • Core Flux: #275 No Clean • Core Size: medium / 2.2% by volume / #58 • DOM: 2022• Spool Size: 1 lb. • RoHS Compliant • Classified as ROL0 per J-STD-004 • Compliant to Bellcore GR-78
Price: 80 USD
Location: South Hackensack, New Jersey
End Time: 2024-02-07T18:46:37.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Container Size: 1 lb
Solder Type: Lead Free No-Clean
Custom Bundle: No
Flux: No-Clean #275
MPN: 24-7068-7601
Alloy: Sn96.5 AG3.0 Cu0.5
Modified Item: No
Alloy Description: SAC305
Brand: Kester
Unit Type: lb
Solder Form: Wire
Model: 24-7068-7601 96.5.031 58/275 AG3 cu0.5
Country/Region of Manufacture: United States
Unit Quantity: 1 lb. spool
Wire Diameter: .031"
Authorized Kester Solder distributor?: Yes. Since 1980